1) ½ÇÀü ¸ðÀÇ°í»ç
- Ãß·Ð, µµÇü, ±âÈ£, Áö¹®¹®Á¦ ¹®Á¦Ç®ÀÌ
- °æ¿ìÀÇ ¼ö¸¦ ³ª´²¼ Ǫ´Â ½À°ü µéÀ̱â
- µµÇü¹®Á¦ ½Ã°£ ´ÜÃà skill : °£´ÜÇÑ °ÍºÎÅÍ Â÷±ÙÂ÷±Ù Ç®°Í, ¾ËÆĺª A~Z±îÁö ¾²°í ¹®Á¦Ç®ÀÌ
- ¹è¿î skillÀ» ¿¬½ÀÇÏ´Â °ÍÀÌ Áß¿ä!
2) MOSFET
- MOSFET ±âº»ÀûÀÎ ±¸Á¶ ¹× µ¿ÀÛ¿ø¸®¿Í ÀÌ»óÀûÀÎ ¿¡³ÊÁö ¹êµå»óÅ¿¡ ´ëÇØ ¹è¿ò
- MOSFETÀÇ Degradation ¿øÀÎ : Trap & TDDB(Time Dependent dielectric Breakdown)
- Trap¿¡¼ÀÇ Key word : 1. defect 2. oxide Ç°Áú
- TDDB¿¡¼ÀÇ Key word : tunneling
- short channel effectÀÇ ¿øÀΰú ÇØ°á¹æ¾È -> °°Àº Áú¹®
1. °øÁ¤ ¹Ì¼¼È 2. Vth roll off(°¨¼Ò) -> ÇØ°á¹æ¾È1 5°¡Áö (gate metal, gate oxide oxidationprogress, doping concentration, Oxide Thickneess, Oxide meterial) & ÇØ°á¹æ¾È body effect(sourc¿Í body»çÀÌ Àü¾Ð Àΰ¡ Vth Á¶Àý)
- Hot carrier effect
ª¾ÆÁø Depletion region¿¡ ÀÇÇØ E-field °È -> ÇØ°á¹æ¾È LDD
-DIBL(Vd¿¡ ÀÇÇØ sourece-channel »çÀÌÀÇ potential barrier°¡ ³·¾ÆÁö´Â Çö»ó)
-punch -through (sourceÀÇ Drain ¿µ¿ªÀÇ Depletion regionÀÌ ¸¶ÁÖÄ¡´Â Çö»ó)
À§ µÑÀÇ ÇØ°á¹æ¾È Halo doping
-HKMG, FinFET, MOSCAPÀÇ Æ¯Â¡